This is the operation of joining the components with PCB after the operation the circuit will be ready to use to avoid any damage or fault during this operation following care must be taken.

1.A longer duration contact between soldering iron bit & components lead can exceed the temperature rating of device & cause partial or total damage of the device. hence before soldering we must carefully read the maximum soldering temperature & soldering time for device.

2.The wattage of soldering iron should be selected as minimum as permissible for that soldering place.

3.To pr0tact the device by leakage current of iron its bit should be earthed properly.

4.We should select the soldering wire with proper ratio of Pb & Tn to provide the suitable melting temperature.

5.Proper amount of good quality flux must be applied on the soldering point to avoid dry soldering.